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Processing study of a high temperature adhesiveAn adhesive-bonding process cycle study was performed for a polyimidesulphone. The high molecular weight, linear aromatic system possesses properties which make it attractive as a processable, low-cost material for elevated temperature applications. The results of a study to better understand the parameters that affect the adhesive properties of the polymer for titanium alloy adherends are presented. These include the tape preparation, the use of a primer and press and simulated autoclave processing conditions. The polymer was characterized using Fourier transform infrared spectroscopy, glass transition temperature determination, flow measurements, and weight loss measurements. The lap shear strength of the adhesive was used to evaluate the effects of the bonding process variations.
Document ID
19840054236
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Progar, D. J.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 12, 2013
Publication Date
April 1, 1984
Publication Information
Publication: International Journal of Adhesion and Adhesives
Volume: 4
ISSN: 0143-7496
Subject Category
Nonmetallic Materials
Accession Number
84A37023
Distribution Limits
Public
Copyright
Other

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