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Design, development and test of a capillary pump loop heat pipeThe development of a capillary pump loop (CPL) heat pipe, including computer modeling and breadboard testing, is presented. The computer model is a SINDA-type thermal analyzer, combined with a pressure analyzer, which predicts the transients of the CPL heat pipe during operation. The breadboard is an aluminum/ammonia transport system which contains multiple parallel evaporator and condenser zones within a single loop. Test results have demonstrated the practicality and reliability of such a design, including heat load sharing among evaporators, liquid inventory/temperature control feature, and priming under load. Transport capability for this system is 65 KW-M with individual evaporator pumps managing up to 1.7 KW at a heat flux of 15 W/sq cm. The prediction of the computer model for heat transport capabilities is in good agreement with experimental results.
Document ID
19840056518
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Kroliczek, E. J.
(OAO Corp. Greenbelt, MD, United States)
Ku, J.
(OAO Corp. Greenbelt, MD, United States)
Ollendorf, S.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 12, 2013
Publication Date
June 1, 1984
Subject Category
Fluid Mechanics And Heat Transfer
Report/Patent Number
AIAA PAPER 84-1720
Accession Number
84A39305
Distribution Limits
Public
Copyright
Other

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