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Chip level modeling of LSI devicesThe advent of Very Large Scale Integration (VLSI) technology has rendered the gate level model impractical for many simulation activities critical to the design automation process. As an alternative, an approach to the modeling of VLSI devices at the chip level is described, including the specification of modeling language constructs important to the modeling process. A model structure is presented in which models of the LSI devices are constructed as single entities. The modeling structure is two layered. The functional layer in this structure is used to model the input/output response of the LSI chip. A second layer, the fault mapping layer, is added, if fault simulations are required, in order to map the effects of hardware faults onto the functional layer. Modeling examples for each layer are presented. Fault modeling at the chip level is described. Approaches to realistic functional fault selection and defining fault coverage for functional faults are given. Application of the modeling techniques to single chip and bit slice microprocessors is discussed.
Document ID
19840066624
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Armstrong, J. R.
(Virginia Polytechnic Institute and State University Blacksburg, VA, United States)
Date Acquired
August 12, 2013
Publication Date
October 1, 1984
Publication Information
Publication: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume: CAD-3
ISSN: 0278-0070
Subject Category
Electronics And Electrical Engineering
Accession Number
84A49411
Funding Number(s)
CONTRACT_GRANT: NAG1-174
CONTRACT_GRANT: F30602-80-C-0200
Distribution Limits
Public
Copyright
Other

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