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Reduced-Stress Mounting for ThermocouplesMounting accommodates widely different coefficients of thermal expansion. In new method, legs of thermocouple placed in separate n- and p-type arrays. Two arrays contact common heat pipe as source but have separate heatpipe sinks. Net expansion (or contraction) taken up by spring mounting on heat-pipe sinks.
Document ID
19850000444
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Wood, C. (Caltech)
Date Acquired
August 12, 2013
Publication Date
March 1, 1986
Publication Information
Publication: NASA Tech Briefs
Volume: 9
Issue: 4
ISSN: 0145-319X
Subject Category
Electronic Components And Circuits
Report/Patent Number
NPO-16513
Accession Number
85B10444
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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