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Mechanical proof testing in cell processingFracture mechanics test methods are applied to evaluate the proof test characteristics of silicon Cz wafers. The results indicate that the strength distribution of silicon wafers is truncated by proof testing and no subcritical crack growth in silicon is observed during proof loading. Mechanical proof testing appears to be an effective method to eliminate weak samples before cell processing.
Document ID
19850053560
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Chen, C. P. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Leipold, M. H. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Ross, R. G. (California Institute of Technology, Jet Propulsion Laboratory, Pasadena CA, United States)
Date Acquired
August 12, 2013
Publication Date
January 1, 1984
Subject Category
Energy Production And Conversion
Meeting Information
Meeting: Photovoltaic Specialists Conference
Location: Kissimmee, FL
Start Date: May 1, 1984
End Date: May 4, 1984
Sponsors: IEEE
Accession Number
85A35711
Distribution Limits
Public
Copyright
Other

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