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Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperaturesThe thermal conductance of oxygen-free high conductivity (COFHC) copper sample pairs with surface finishes ranging from 0.1 to 1.6-micrometers rms roughness was investigated over the range of 1.6 to 6.0-K under applied contact forces up to 670 N. The thermal conductance increases with increasing contact force; however, no correlation can be drawn with respect to surface finish.
Document ID
19850059179
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Salerno, L. J.
(NASA Ames Research Center Moffett Field, CA, United States)
Kittel, P.
(NASA Ames Research Center Moffett Field, CA, United States)
Spivak, A. L.
(Trans-Bay Electronics Richmond, CA, United States)
Date Acquired
August 12, 2013
Publication Date
January 1, 1985
Subject Category
Engineering (General)
Accession Number
85A41330
Distribution Limits
Public
Copyright
Other

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