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Ultrasonic Bonding to Metalized PlasticNew technique makes it possible to bond wires ultrasonically to conductor patterns on such soft substrates as plain or ceramic-filled polytetrafluoroethylene. With ultrasonic bonding, unpackaged chips attached to soft circuit boards. Preferred because chips require substrate area and better matched electrically to circuit board at high frequencies.
Document ID
19860000008
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Conroy, B. L.
(Caltech)
Cruzan, C. T.
(Caltech)
Date Acquired
August 12, 2013
Publication Date
June 1, 1986
Publication Information
Publication: NASA Tech Briefs
Volume: 10
Issue: 1
ISSN: 0145-319X
Subject Category
Electronic Components And Circuits
Report/Patent Number
NPO-16087
Accession Number
86B10008
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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