Status of high temperature adhesivesThe status of high temperature organic adhesives is reviewed. These materials are defined by having usable adhesive properties at temperatures ranging from 232 C (after hundreds of hours at 232 C) to 538 C (after a few minutes at 538 C). The search for high temperature adhesives began in the 1960s, primarily under government funding. Since then, many high temperature polymers have undergone evaluation as adhesives. In spite of this effort, only a few are commercially available because of an elusive market and an unfavorable combination of price, processability and performance. The principal adhesives to be discussed will be addition and condensation polyimides, polyquinoxalines, polybenzimidazoles, and addition, condensation, and cross-linked polyphenylquinoxalines. The synthesis, processability, adhesive performance, and availabiity of these materials are addressed.
Document ID
19860031498
Acquisition Source
Legacy CDMS
Document Type
Conference Proceedings
Authors
Hergenrother, P. M. (NASA Langley Research Center Hampton, VA, United States)