Film and interstitial formation of metals in plasma-sprayed ceramics

A method is described to electrodeposit noble metals such as platinum and ordinary metals such as copper on and within plasma-sprayed ceramic materials and ceramic fiber materials. Low-density ceramic fiber bodies were vacuum impregnated with plating solution and attached to an electrode. Light micrographs illustrating the density and location of deposited materials are presented and discussed. Voids in the plasma-sprayed ceramic were filled with deposits that vary from spherical to lens-shaped circular and have particle size corresponding to the full range of void size. Multiple coatings of ceramic and metal can be sequenced.