Development of an Advanced Trapezoidal Axially Grooved (ATAG) heat pipe

This paper discusses the breadboard development of an Advanced Trapezoidal Axially Grooved (ATAG) heat pipe, which will satisfy space constructible radiator heat rejection requirements for large space power systems. The ATAG heat pipe development program includes a technology demonstration of Space Station heat load and temperature requirements through the design, fabrication, and testing of breadboard and preprototype units. A parametric analysis was conducted to determine trapezoidal groove geometries that could meet the transport performance goal and could be fabricated by available extrusion technology for a diameter chosen to be compatible with an existing development test unit of a cylindrical, pressure-actuated contact heat exchanger. Performance test results for the breadboard heat pipes are presented.