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Nondestructive evaluation of adhesive bond strength using the stress wave factor techniqueAcousto-ultrasonic nondestructive evaluation has been conducted to evaluate the adhesive bond strength between rubber and steel plates using the stress wave factor (SWF) measurement technique. Specimens with different bond strength were manufactured and tested using the SWF technique. Two approaches were used to define the SWF. One approach defines the SWF as the signal energy and the other approach defines the SWF as the square root of the zero moment of the frequency spectrum of the received signal. The strength of the rubber-steel adhesive joint was then evaluated using the destructive peel strength test method. It was observed that in both approaches higher values of the SWF measurements correspond to higher values of the peel strength test data. Therefore, these results show that the stress wave factor technique has the potential of being used in quality assurance of the adhesive bond strength between rubber and steel substrates.
Document ID
19870044926
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Dos Reis, Henrique L. M.
(Illinois, University Urbana, United States)
Krautz, Harold E.
(NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
August 13, 2013
Publication Date
December 1, 1986
Publication Information
Publication: Journal of Acoustic Emission
Volume: 5
ISSN: 0730-0050
Subject Category
Quality Assurance And Reliability
Accession Number
87A32200
Distribution Limits
Public
Copyright
Other

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