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Laser Micromachining In A Reactive AtmosphereDrilling of deep holes in silicon by laser beam aided by conducting operation in reactive atmosphere. Atmosphere reacts with material ejected from hole and converts material to gas flowing away from work area. Hole cleaner and more sharply defined, and debris do not spatter surface of work.
Document ID
19880000443
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Shlichta, Paul J. (Caltech)
Zahaykevich, George (Advanced Laser Systems, Inc.)
Date Acquired
August 13, 2013
Publication Date
September 1, 1988
Publication Information
Publication: NASA Tech Briefs
Volume: 12
Issue: 8
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
NPO-16587
Accession Number
88B10443
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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