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Application of copper-carbon fiber composites to power semiconductor devicesCopper-carbon composite electrodes are used in a series of power semiconductor devices, i.e., resin molded diodes, button-type diodes, stud-type diodes, power modules, and integrated circuit igniter modules. The properties of these power semiconductor devices compare favorably with those conventional devices using Mo or W electrodes. In thermal fatigue tests, no degradation in the electrical and mechanical characteristics of these devices are observed. The new composite electrode with carbon fibers satisfies all of the major requirements for the electrodes in power semiconductor devices.
Document ID
19880012717
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Kuniya, Keiichi
(NASA Headquarters Washington, DC United States)
Arakawa, Hideo
(NASA Headquarters Washington, DC United States)
Sakaue, Tadashi
(NASA Headquarters Washington, DC United States)
Minorikawa, Hitoshi
(NASA Headquarters Washington, DC United States)
Akeyama, Kenji
(NASA Headquarters Washington, DC United States)
Sakamoto, Tatsuji
(NASA Headquarters Washington, DC United States)
Date Acquired
September 5, 2013
Publication Date
May 1, 1988
Subject Category
Composite Materials
Report/Patent Number
NAS 1.77:20171
NASA-TT-20171
Accession Number
88N22101
Funding Number(s)
CONTRACT_GRANT: NASW-4307
Distribution Limits
Public
Copyright
Public Use Permitted.
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