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Thermal Stresses In Space-Shuttle WingCombined thermal deformations of wing-skin panel and TPS would not tear SIP layer. Report presents analysis of thermal stresses induced in skin panel, thermal-protection system (TPS), and strain-isolation pad (SIP) of Space Shuttle orbiter. Purpose of analysis to determine whether any part of above mentioned structures overstressed and overdeformed under reentry heating, assuming one TPS tile lost at end of reentry heating.
Document ID
19890000312
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Ko, William L. (NASA Ames Research Center, Moffett Field, CA.)
Jenkins, Jerald M. (NASA Ames Research Center, Moffett Field, CA.)
Date Acquired
August 14, 2013
Publication Date
June 1, 1989
Publication Information
Publication: NASA Tech Briefs
Volume: 13
Issue: 6
ISSN: 0145-319X
Subject Category
Mechanics
Report/Patent Number
ARC-12139
Accession Number
89B10312
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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