Comb/serpentine/cross-bridge test structure for fabrication process evaluationThe comb/serpentine/cross-bridge structure was developed to monitor and evaluate same layer shorts and step coverage problems (open and high-resistance wire over steps) for integrated circuit fabrication processes. The cross-bridge provides local measurements of wire sheet resistance and wirewidth. These local parametric measurements are used in the analysis of the serpentine wire, which identifies step coverage problems. The comb/serpentine/cross-bridge structure was fabricated with 3 microns CMOS/bulk p-well process and tested using a computer-controlled parametric test system.
Document ID
19890044956
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Sayah, Hoshyar R. (Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA, United States)
Buehler, Martin G. (California Institute of Technology Jet Propulsion Laboratory, Pasadena, United States)