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Thermal grease replacement for the modular power subsystemA comparative thermal conductance test was conducted to evaluate thermal interface materials for use on the Modular Power Subsystem. Materials tested included three thermal pads, four RTV adhesives, bare metal, and one thermal grease. The tests were conducted in a bell jar at vacuum conditions using a 1400 square centimeter footprint and two relatively low contact pressures, 207 kPa and 620 kPa. Power inputs ranged from 100 to 500 watts, and the thermal interface conductance values ranged from 100 to 1700 W/m2 C for the interstitial materials tested. In general, the thermal pads performed a little better than bare metal, while the RTV adhesives performed significantly better than the bare metal and comparable to the thermal grease.
Document ID
19900051330
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Lapinski, John R., Jr.
(McDonnell Douglas Electronic Systems Co. Saint Louis, MO, United States)
Ousley, Gilbert W., Jr.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Date Acquired
August 14, 2013
Publication Date
June 1, 1990
Subject Category
Spacecraft Propulsion And Power
Report/Patent Number
AIAA PAPER 90-1682
Accession Number
90A38385
Distribution Limits
Public
Copyright
Other

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