Heat flux induced dryout and rewet in thin films

Heat flux induced dryout of thin liquid films on an inclined copper plate was studied. Rewet of the dried out area is also considered. The four fluids used to form the thin films exhibited very different dryout and rewet characteristics. The contact angle and hysteresis effects were found to be important, but they must be considered in context with other parameters. No single variable was found to independently determine the pattern of dryout and rewet.