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Grain boundary sliding behaviour of copper and alpha brass at intermediate temperaturesThe role of grain boundary sliding in copper and Cu-30 pct Zn in the temperature range 0.50-0.72 Tm, where Tm is the absolute melting point of the material, is examined. First, sliding data obtained on these materials are presented. The results indicate that the stress exponent for sliding is similar to that for lattice deformation, while the activation energy for sliding varies between 0.5 and 1.6 of the activation energy for creep. Several models proposed for grain boundary sliding are discussed, and it is shown that they do not account for the observed results on copper and alpha brass. A phenomenological model is proposed, where it is assumed that grain boundary sliding results from the glide of dislocations on secondary slip planes.
Document ID
19910042535
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Raj, S. V.
(NASA Lewis Research Center Cleveland, OH, United States)
Date Acquired
August 14, 2013
Publication Date
February 15, 1991
Publication Information
Publication: Journal of Materials Science
Volume: 26
ISSN: 0022-2461
Subject Category
Metallic Materials
Accession Number
91A27158
Distribution Limits
Public
Copyright
Other

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