Thermal and structural assessments of a ceramic wafer seal in hypersonic engineThe thermal and structural performances of a ceramic wafer seal in a simulated hypersonic engine environment are numerically assessed. The effects of aerodynamic heating, surface contact conductance between the seal and its adjacent surfaces, flow of purge coolant gases, and leakage of hot engine flow path gases on the seal temperature were investigated from the engine inlet back to the entrance region of the combustion chamber. Finite element structural analyses, coupled with Weibull failure analyses, were performed to determine the structural reliability of the wafer seal.
Document ID
19910057176
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Tong, Mike (NASA Lewis Research Center Cleveland; Sverdrup Technology, Inc., Brook Park, OH, United States)
Steinetz, Bruce (NASA Lewis Research Center Cleveland, OH, United States)