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Thermal power loopsThe concept of a thermal power loop (TPL) to transport thermal power over relatively large distances is presented as an alternative to heat pipes and their derivatives. The TPL is compared to heat pipes, and capillary pumped loops with respect to size, weight, conservation of thermal potential, start-up, and 1-g testing capability. Test results from a proof of feasibility demonstrator at the NASA JPL are discussed. This analysis demonstrates that the development of specific thermal power loops will result in substantial weight and cost savings for many spacecraft.
Document ID
19910068970
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Gottschlich, Joseph M.
(USAF, Wright Laboratory, Wright-Patterson AFB OH, United States)
Richter, Robert
(JPL Pasadena, CA, United States)
Date Acquired
August 14, 2013
Publication Date
April 1, 1991
Subject Category
Fluid Mechanics And Heat Transfer
Report/Patent Number
SAE PAPER 911188
Accession Number
91A53593
Distribution Limits
Public
Copyright
Other

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