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High-performance packaging for monolithic microwave and millimeter-wave integrated circuitsPackaging schemes were developed that provide low-loss, hermetic enclosure for advanced monolithic microwave and millimeter-wave integrated circuits (MMICs). The package designs are based on a fused quartz substrate material that offers improved radio frequency (RF) performance through 44 gigahertz (GHz). The small size and weight of the packages make them appropriate for a variety of applications, including phased array antenna systems. Packages were designed in two forms; one for housing a single MMIC chip, the second in the form of a multi-chip phased array module. The single chip array module was developed in three separate sizes, for chips of different geometry and frequency requirements. The phased array module was developed to address packaging directly for antenna applications, and includes transmission line and interconnect structures to support multi-element operation. All packages are fabricated using fused quartz substrate materials. As part of the packaging effort, a test fixture was developed to interface the single chip packages to conventional laboratory instrumentation for characterization of the packaged devices. The package and test fixture designs were both developed in a generic sense, optimizing performance for a wide range of possible applications and devices.
Document ID
19920022611
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Shalkhauser, K. A.
(NASA Lewis Research Center Cleveland, OH, United States)
Li, K.
(Hughes Aircraft Co. Torrance, CA., United States)
Shih, Y. C.
(Hughes Aircraft Co. Torrance, CA., United States)
Date Acquired
September 6, 2013
Publication Date
January 1, 1992
Subject Category
Communications And Radar
Report/Patent Number
NAS 1.15:105744
NASA-TM-105744
E-7149
Meeting Information
Meeting: International Communications Satellite Systems Conference
Location: Washington, DC
Country: United States
Start Date: March 22, 1992
End Date: March 26, 1992
Sponsors: AIAA
Accession Number
92N31855
Funding Number(s)
PROJECT: RTOP 506-72-1C
CONTRACT_GRANT: NAS3-25870
Distribution Limits
Public
Copyright
Public Use Permitted.
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