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Thermally stable, low dielectric polyquinolines for aerospace and electronics applicationsFour new high molecular weight, linear chain polyquinolines have been synthesized and fabricated into high quality free standing films. These polymers are characterized by moderate to high glass transition temperatures, excellent thermal and thermooxidative stability, extremely low dielectric constants and good planarizing characteristics. The polymers absorb very low quantities of moisture. As a consequence, the dielectric constant of one new polyquinoline has been shown to be quite insensitive to exposure to warm/wet conditions. Isothermal aging of one new derivative in air has been carried out at elevated temperatures (250 C to 345 C). The results demonstrate truly outstanding thermooxidative stability. Additional characterizations include molecular weight determinations, solubilities and film-forming characteristics, density measurements, and UV-Vis spectroscopy. The data acquired to date suggest that the polymers may find use as refractive films and coatings and as interlevel planarizers in microelectronics applications.
Document ID
19920027699
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Hendricks, Neil H.
(Maxdem, Inc. Pasadena, CA, United States)
Marrocco, Matthew L.
(Maxdem, Inc. Pasadena, CA, United States)
Stoakley, Diane M.
(Maxdem, Inc. Pasadena, CA, United States)
St. Clair, Anne K.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 15, 2013
Publication Date
January 1, 1990
Subject Category
Nonmetallic Materials
Meeting Information
Meeting: International SAMPE Electronic Materials and Processes Conference
Location: Albuquerque, NM
Country: United States
Start Date: June 12, 1990
End Date: June 14, 1990
Accession Number
92A10323
Distribution Limits
Public
Copyright
Other

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