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128 layer HYMOSS module fabrication issuesThe fabrication of the first Z-technology module with 128 active layers of readout electronic circuitry is being pursued. Several issues which will be investigated regarding the 128-layer module build, such as photolithographic processing at the edge of the module (edge effects) and module buttability, are discussed in this paper. Other topics which are covered apply to future applications of fully populated HYMOSS modules. These topics include possible reductions of thermal mass for quick cool-down time applications and improvements of end-to-end yield for low-cost applications.
Document ID
19920034650
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Ludwig, David E.
(Irvine Sensors Corp. Costa Mesa, CA, United States)
Date Acquired
August 15, 2013
Publication Date
January 1, 1990
Subject Category
Electronics And Electrical Engineering
Meeting Information
Meeting: Materials, Devices, Techniques and Applications for Z-Plane Focal Plane Array Technology II
Location: San Diego, CA
Country: United States
Start Date: July 12, 1990
End Date: July 13, 1990
Sponsors: SPIE
Accession Number
92A17274
Funding Number(s)
CONTRACT_GRANT: NAS8-38410
Distribution Limits
Public
Copyright
Other

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