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Stress versus temperature dependence of activation energies for creepThe activation energy for creep at low stresses and elevated temperatures is associated with lattice diffusion, where the rate controlling mechanism for deformation is dislocation climb. At higher stresses and intermediate temperatures, the rate controlling mechanism changes from dislocation climb to obstacle-controlled dislocation glide. Along with this change in deformation mechanism occurs a change in the activation energy. When the rate controlling mechanism for deformation is obstacle-controlled dislocation glide, it is shown that a temperature-dependent Gibbs free energy does better than a stress-dependent Gibbs free energy in correlating steady-state creep data for both copper and LiF-22mol percent CaF2 hypereutectic salt.
Document ID
19920042095
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Freed, A. D.
(NASA Lewis Research Center Cleveland, OH, United States)
Raj, S. V.
(NASA Lewis Research Center Cleveland, OH, United States)
Walker, K. P.
(Engineering Science Software, Inc. Smithfield, RI, United States)
Date Acquired
August 15, 2013
Publication Date
January 1, 1992
Publication Information
Publication: ASME, Transactions, Journal of Engineering Materials and Technology
Volume: 114
ISSN: 0094-4289
Subject Category
Structural Mechanics
Accession Number
92A24719
Distribution Limits
Public
Copyright
Other

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