Improving processing and toughness of a high performance composite matrix through an interpenetrating polymer network. VIA simultaneous semi-interpenetrating polymer network (semi-IPN) concept is presented which combines easy-to-process, but brittle, thermosetting polyimides with tough, but difficult to process, linear thermoplastic polyimides. The combination results in a semi-IPN with the easy processability of a thermoset and good toughness of a thermoplastic. Four simultaneous semi-IPN systems were developed from commercially available NR-150B2 combined with each of the four Thermid materials (LR-600, AL-600, MC-600, and FA-700). It is concluded that there is a significant improvement in resin fracture toughness of Thermid-polyimide-based semi-IPN systems and some improvement in composite microcracking resistance compared to Thermid LR-600. Excellent composite mechanical properties have been achieved. These new semi-IPN materials have the potential to be used as composite matrices, adhesives, and molding materials.
Document ID
19920065469
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Pater, Ruth H. (NASA Langley Research Center Hampton, VA, United States)