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Welding Wires To Thin Thermocouple FilmsParallel-gap resistance welding yields joints surviving temperatures of about 1,000 degrees C. Much faster than thermocompression bonding. Also exceeds conductive-paste bonding and sputtering thin films through porous flame-sprayed insulation on prewelded lead wires. Introduces no foreign material into thermocouple circuit and does not require careful control of thickness of flame-sprayed material.
Document ID
19930000103
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Holanda, Raymond (NASA Lewis Research Center, Cleveland, OH.)
Kim, Walter S. (NASA Lewis Research Center, Cleveland, OH.)
Danzey, Gerald A. (NASA Lewis Research Center, Cleveland, OH.)
Pencil, Eric (Cincinnati Univ.)
Wadel, Mary (Cincinnati Univ.)
Date Acquired
August 16, 2013
Publication Date
February 1, 1993
Publication Information
Publication: NASA Tech Briefs
Volume: 17
Issue: 2
ISSN: 0145-319X
Subject Category
Fabrication Technology
Report/Patent Number
LEW-15100
Accession Number
93B10103
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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IDRelationTitleN90-21361/TBSee AlsoAttachment Of Lead Wires To Thin Film Thermocouples Mounted On High Temperature Materials Using The Parallel Gap Welding Process
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