Ultrasonic Imaging Of Bond Layers Through Bond Layers

Combination of hardware and software helps ultrasonic C-scan inspection system create images of bond layer in laminated composite material, even when obscured by another bond layer. Produces image of both layers in single scan. Includes ultrasonic transducer, pulser/receiver, mechanical scanner, personal computer as controller, and electronic circuitry that gates first and second peak signals, detects peaks, and feeds resulting amplitude data to computer.