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Performance of thermal adhesives in forced convectionCooling is critical for the life and performance of electronic equipment. In most cases cooling may be achieved by natural convection but forced convection may be necessary for high wattage applications. Use of conventional type heat sinks may not be feasible from the viewpoint of specific applications and the costs involved. In a heat sink, fins can be attached to the well by ultrasonic welding, by soldering, or with a number of industrially available thermal adhesives. In this paper, the author investigates the heat transfer characteristics of several adhesives and compares them with ultrasonic welding and theoretically calculated values. This experiment was conducted in an air flow chamber. Heat was generated by using heaters mounted on the well. Thermstrate foil, Uniset A401, and Aremco 571 adhesives were tested along with an ultrasonically welded sample. Ultrasonic welding performed far better than the adhesives and Thermstrate foil. This type of experiment can be adapted for a laboratory exercise in an upper level heat transfer course. It gives students an exposure to industrial applications that help them appreciate the importance of the course material.
Document ID
19930021785
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Kundu, Nikhil K.
(Purdue Univ. Elkhart, IN, United States)
Date Acquired
September 6, 2013
Publication Date
June 1, 1993
Publication Information
Publication: NASA. Langley Research Center, National Educators' Workshop. Update 92: Standard Experiments in Engineering Materials Science and Technology
Subject Category
Nonmetallic Materials
Accession Number
93N30974
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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