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Numerical solutions for heat flow in adhesive lap jointsThe present formulation for the modeling of heat transfer in thin, adhesively bonded lap joints precludes difficulties associated with large aspect ratio grids required by standard FEM formulations. This quasi-static formulation also reduces the problem dimensionality (by one), thereby minimizing computational requirements. The solutions obtained are found to be in good agreement with both analytical solutions and solutions from standard FEM programs. The approach is noted to yield a more accurate representation of heat-flux changes between layers due to a disbond.
Document ID
19930034629
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Howell, P. A.
(NASA Langley Research Center Hampton, VA, United States)
Winfree, William P.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 15, 2013
Publication Date
January 1, 1992
Publication Information
Publication: In: Review of progress in quantitative nondestructive evaluation. Vol. 11A; Proceedings of the 18th Annual Review, Brunswick, ME, July 28-Aug. 2, 1991 (A93-18576 05-38)
Publisher: Plenum Press
Subject Category
Quality Assurance And Reliability
Accession Number
93A18626
Funding Number(s)
CONTRACT_GRANT: NAS1-19236
Distribution Limits
Public
Copyright
Other

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