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The effect of diamic acid additives on the dielectric constant of polyimidesThe effect of six selected diamic acids additives (including 2,2-prime bis(3,4-dicarboxyphenyl) hexafluoropropane dianhydride-aniline (An); 4,4-prime-oxydiphthalic anhydride-An, 3,3-prime diaminodiphenyl sulfone-phthalic anhydride (PA); 4,4-prime-oxydianiline-PA; 2,2-bis 4(4-aminophenoxy)phenyl hexafluoropropane-PA; and 2,2-bis 4(3-aminophenoxy)phenyl hexafluoropropane-PA) on the dielectric constants of low-dielectric-constant polyimide resins was evaluated. It was found that the effect of the incorporation of the diamic acids on reducing the dielectric constant of polyimides may be limited as the dielectric constant of the base resin itself becomes very low. The additives were found to lower the resin's values of glass transition temperature, with no effect on thermooxidative stability.
Document ID
19930065651
Acquisition Source
Legacy CDMS
Document Type
Conference Paper
Authors
Stoakley, Diane M.
(NASA Langley Research Center Hampton, VA, United States)
St. Clair, Anne K.
(NASA Langley Research Center Hampton, VA, United States)
Date Acquired
August 16, 2013
Publication Date
September 1, 1988
Subject Category
Nonmetallic Materials
Accession Number
93A49648
Distribution Limits
Public
Copyright
Other

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