NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Back to Results
Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH) programA joint military-commercial effort to evaluate multichip module (MCM) structures is discussed. The program, Reliability Technology to Achieve Insertion of Advanced Packaging (RELTECH), has been designed to identify the failure mechanisms that are possible in MCM structures. The RELTECH test vehicles, technical assessment task, product evaluation plan, reliability modeling task, accelerated and environmental testing, and post-test physical analysis and failure analysis are described. The information obtained through RELTECH can be used to address standardization issues, through development of cost effective qualification and appropriate screening criteria, for inclusion into a commercial specification and the MIL-H-38534 general specification for hybrid microcircuits.
Document ID
19930071758
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
External Source(s)
Authors
Fayette, Daniel F.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Speicher, Patricia
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Stoklosa, Mark J.
(USAF, Rome Lab. Griffiss AFB, NY, United States)
Evans, Jillian V.
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Evans, John W.
(NASA Headquarters Washington, DC United States)
Gentile, Mike
(NASA Goddard Space Flight Center Greenbelt, MD, United States)
Pagel, Chuck A.
(U.S. Navy, Naval Surface Warfare Center Crane, IN, United States)
Hakim, Edward
(U.S. Army, Research Lab. Fort Monmouth, NJ, United States)
Date Acquired
August 16, 2013
Publication Date
August 1, 1993
Publication Information
Publication: IEEE Aerospace and Electronic Systems Magazine
Volume: 8
Issue: 8
ISSN: 0885-8985
Subject Category
Quality Assurance And Reliability
Accession Number
93A55755
Distribution Limits
Public
Copyright
Other

Available Downloads

There are no available downloads for this record.
No Preview Available