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Metal-Ion Additives Reduce Thermal Expansion Of PolyimidesPolyimides widely used as high-performance polymers because of their excellent thermal stability and toughness. However, their coefficients of thermal expansion (CTE's) greater than those of metals, ceramics, and glasses. Decreasing CTE's of polyimides increase usefulness for aerospace and electronics applications in which dimensional stability required. Additives containing metal ions reduce coefficients of thermal expansion of polyimides. Reductions range from 11 to over 100 percent.
Document ID
19940000208
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Stoakley, Diane M.
(NASA Langley Research Center, Hampton, VA.)
St. Clair, Anne K.
(NASA Langley Research Center, Hampton, VA.)
Emerson, Burt R., Jr.
(NASA Langley Research Center, Hampton, VA.)
Willis, George L.
(NASA Langley Research Center, Hampton, VA.)
Date Acquired
August 16, 2013
Publication Date
April 1, 1994
Publication Information
Publication: NASA Tech Briefs
Volume: 18
Issue: 4
ISSN: 0145-319X
Subject Category
Materials
Report/Patent Number
LAR-14538
Accession Number
94B10208
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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