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Measuring Thicknesses With In Situ Ultrasonic TransducersSeveral pulsed ultrasonic transducers attached to workpiece for measurement of changes in thicknesses of workpiece at transducer locations during grinding and polishing, according to proposal. Once attached, each transducer remains attached at original position until all grinding and polishing operations complete. In typical application, workpiece glass or ceramic blank destined to become component of optical system.
Document ID
19950065579
Acquisition Source
Legacy CDMS
Document Type
Other - NASA Tech Brief
Authors
Dunn, Daniel E. (Hughes Danbury Optical Systems, Inc.)
Cerino, Joseph R. (Hughes Danbury Optical Systems, Inc.)
Date Acquired
August 17, 2013
Publication Date
September 1, 1995
Publication Information
Publication: NASA Tech Briefs
Volume: 19
Issue: 9
ISSN: 0145-319X
Subject Category
Physical Sciences
Report/Patent Number
MFS-28892
Accession Number
95B10420
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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