Low volume packaging for a microinstrumentation system

A folding, multi-platform assembly has been developed for the packaging of a multi-chip microinstrumentation system. The assembly includes three solid platforms connected by flexible micromachined ribbon cables and it can be populated by sensors and electronics from a variety of technologies including surface mount and integrated circuit (IC) processes. The entire structure is fabricated from a four-inch silicon wafer using a simple four mask process and a post-process EDP etch. The micromachined ribbon cables allow the platform assembly to be folded into a three level structure with control electronics on the bottom level, microsensors and interface electronics on the second level, and sensors that need environmental access on the top level. Using the silicon multi-platform assembly, a prototype microinstrumentation system has been developed that includes a microcontroller unit and sensors for measuring temperature, barometric pressure, humidity, altitude, and acceleration as well as a telemetry device for wireless communication. When folded in the three level structure, this microsystem occupies only 5 cc and can be placed in an outer case the size of a wristwatch.