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Preliminary reliability evaluation of flip chip on flex interconnect technologyThe study was carried out to evaluate the flip-chip-on-flex (FCOF) interconnection process in order to determine its feasibility for space flight applications. The key objectives were to: develop and apply simple and cost effective process steps needed to manufacture FCOFs and build test samples; perform a preliminary technology validation, and determine any initial environmental or application risks. The FCOF was shown to be simpler and more economical than other chip interconnection schemes.
Document ID
19980033571
Acquisition Source
Goddard Space Flight Center
Document Type
Conference Paper
Authors
Shaw, Jack J.
(NASA Goddard Space Flight Center Greenbelt, MD United States)
Virmani, Naresh
(Swales and Associates Beltsville, MD United States)
Date Acquired
August 18, 2013
Publication Date
July 1, 1997
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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