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Computational Chemistry of Adhesive BondsThis investigation is intended to determine the electrical mechanical, and chemical properties of adhesive bonds at the molecular level. The initial determinations will be followed by investigations of the effects of environmental effects on the chemistry and properties of the bond layer.
Document ID
19990068472
Acquisition Source
Langley Research Center
Document Type
Conference Paper
Authors
Phillips, Donald H.
(NASA Langley Research Center Hampton, VA United States)
Date Acquired
August 19, 2013
Publication Date
May 1, 1999
Publication Information
Publication: Proceedings of the Second Annual Symposium for Nondestructive Evaluation of Bond Strength
Subject Category
Quality Assurance And Reliability
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
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