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Novel Techniques for Millimeter-Wave PackagesA new millimeter-wave package architecture with supporting electrical, mechanical and material science experiment and analysis is presented. This package is well suited for discrete devices, monolithic microwave integrated circuits (MMIC's) and multichip module (MCM) applications. It has low-loss wide-band RF transitions which are necessary to overcome manufacturing tolerances leading to lower per unit cost Potential applications of this new packaging architecture which go beyond the standard requirements of device protection include integration of antennas, compatibility to photonic networks and direct transitions to waveguide systems. Techniques for electromagnetic analysis, thermal control and hermetic sealing were explored. Three dimensional electromagnetic analysis was performed using a finite difference time-domain (FDTD) algorithm and experimentally verified for millimeter-wave package input and output transitions. New multi-material system concepts (AlN, Cu, and diamond thin films) which allow excellent surface finishes to be achieved with enhanced thermal management have been investigated. A new approach utilizing block copolymer coatings was employed to hermetically seal packages which met MIL STD-883.
Document ID
19990099709
Acquisition Source
Jet Propulsion Laboratory
Document Type
Reprint (Version printed in journal)
External Source(s)
Authors
Herman, Martin I.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA United States)
Lee, Karen A.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA United States)
Kolawa, Elzbieta A.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA United States)
Lowry, Lynn E.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA United States)
Tulintseff, Ann N.
(Jet Propulsion Lab., California Inst. of Tech. Pasadena, CA United States)
Date Acquired
August 19, 2013
Publication Date
July 1, 1995
Publication Information
Publication: IEEE Transactions on Microwave Theory and Techniques
Publisher: Institute of Electrical and Electronic Engineers
Volume: 43
Issue: 7
ISSN: 0018-9480
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Other

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