Boiling Heat Transfer Measurements on Highly Conductive Surfaces Using Microscale Heater and Temperature Arrays

Two systems have been developed to study boiling heat transfer on the microscale. The first system utilizes a 32 x 32 array of diodes to measure the local temperature fluctuations during boiling on a silicon wafer heated from below. The second system utilizes an array of 96 microscale heaters each maintained at constant surface temperature using electronic feedback loops. The power required to keep each heater at constant temperature is measured, enabling the local heat transfer coefficient to be determined. Both of these systems as well as some preliminary results are discussed.