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Elevated Temperature Slow Crack Growth of Silicon Nitride Under Dynamic, Static and Cyclic Flexural LoadingThe slow crack growth parameters of a hot-pressed silicon nitride were determined at 1200 and 1300 C in air by statically, dynamically and cyclicly loading bend specimens. The fatigue parameters were estimated using the recently developed CARES/Life computer code. Good agreement exists between the flexural results. However, fatigue susceptibility under static uniaxial tensile loading, reported elsewhere, was greater than in flexure. Cyclic flexural loading resulted in the lowest apparent flexural fatigue susceptibility.
Document ID
20010036662
Acquisition Source
Legacy CDMS
Document Type
Reprint (Version printed in journal)
Authors
Choi, Sung R.
(Cleveland State Univ. Cleveland, OH United States)
Salem, Jonathan A.
(NASA Lewis Research Center Cleveland, OH United States)
Nemeth, Noel
(NASA Lewis Research Center Cleveland, OH United States)
Gyekenyesi, John P.
(NASA Lewis Research Center Cleveland, OH United States)
Date Acquired
August 20, 2013
Publication Date
January 1, 1994
Publication Information
Publication: Ceramic Engineering and Science Proceedings
Publisher: American Ceramic Society
Volume: 15
Subject Category
Metals And Metallic Materials
Distribution Limits
Public
Copyright
Other

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