High Temperature Slow Crack Growth of Si3N4 Specimens Subjected to Uniaxial and Biaxial Dynamic Fatigue Loading Conditions

The slow crack growth of a hot-pressed silicon nitride was determined at 1300 C in air using dynamic fatigue testing under both uniaxial and biaxial stress states. Good agreement in fatigue parameter exists between the data obtained from uniaxial and biaxial loading conditions. A reasonable prediction of dynamic fatigue from one stress state to another was made using the recently developed CARES/LIFE computer code.