Advanced RF Front End Technology

The ability to achieve low-mass low-cost micro/nanospacecraft for Deep Space exploration requires extensive miniaturization of all subsystems. The front end of the Telecommunication subsystem is an area in which major mass (factor of 10) and volume (factor of 100) reduction can be achieved via the development of new silicon based micromachined technology and devices. Major components that make up the front end include single-pole and double-throw switches, diplexer, and solid state power amplifier. JPL's Center For Space Microsystems - System On A Chip (SOAC) Program has addressed the challenges of front end miniaturization (switches and diplexers). Our objectives were to develop the main components that comprise a communication front end and enable integration in a single module that we refer to as a 'cube'. In this paper we will provide the latest status of our Microelectromechanical System (MEMS) switches and surface micromachined filter development. Based on the significant progress achieved we can begin to provide guidelines of the proper system insertion for these emerging technologies. Additional information is contained in the original extended abstract.