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Protective Fullerene (C60) Packaging System for Microelectromechanical Systems ApplicationsThe invention involves a method for locating the probe of a scanning tunneling micrograph a predetermined distance from its conducting surface, and specifically the deposition of a monolayer of fullerene C60 onto the conducting plate. The Fullerene C60 molecule is approximately spherical and a monolayer of fullerene has a thickness of one nanometer. By providing a monolayer of fullerene on the conducting surface and locating the probe on the surface of the monolayer, a distance of one nanometer can be established between the probe tip and the conducting surface.
Document ID
20010110720
Acquisition Source
Headquarters
Document Type
Other - Patent
External Source(s)
NPO-20148-2
Authors
John D Olivas
(Jet Propulsion Laboratory La Cañada Flintridge, United States)
Date Acquired
August 20, 2013
Publication Date
August 21, 2001
Publication Information
Publisher: United States Patent and Trademark Office
Subject Category
Electronics And Electrical Engineering
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-6,277,438
Patent Application
US-Patent-Appl-SN-310774
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