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Electrocomposite of Alumina in Nickel MatrixNickel/aluminum oxide composite was electroformed in a sulfamate bath with 50 g/L of 0.05-micron aluminum oxide powder. Different plating methods including direct current plating, periodic pulse plating, and periodic reverse pulse plating were used. With conventional direct current plating, the maximum particle inclusion in the nickel matrix remains about 2% (wt). However, much higher percentile particle inclusions were achieved when a specific pulse reversal plating technique was applied. The particle incorporation approaches theoretical maximum when the deposit thickness per cycle approaches the particle diameter size at lower duty cycle. The highest particle incorporation achieved is 23% (by weight). Conceptual models interpreting the dramatic differences in the results of these plating methods were also proposed.
Document ID
20040076916
Acquisition Source
Marshall Space Flight Center
Document Type
Conference Paper
Authors
Xiong-Skiba, Pei
(Austin Peay State Univ. Clarksville, TN, United States)
Hulguin, Ryan
(Austin Peay State Univ. Clarksville, TN, United States)
Engelhaupt, Darell
(Alabama Univ. Huntsville, AL, United States)
Ramsey, Brian
(National Space Science and Technology Center Huntsville, AL, United States)
Date Acquired
August 21, 2013
Publication Date
January 1, 2004
Subject Category
Metals And Metallic Materials
Meeting Information
Meeting: 205th Meeting of the Electrochemical Society
Location: Antonio, TX
Country: United States
Start Date: May 9, 2004
End Date: May 13, 2004
Sponsors: Electrochemical Society, Inc.
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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