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Nano-engineered Multiwall Carbon Nanotube-copper Composite Thermal Interface Material for Efficient Heat ConductionEfforts in integrated circuit (IC) packaging technologies have recently been focused on management of increasing heat density associated with high frequency and high density circuit designs. While current flip-chip package designs can accommodate relatively high amounts of heat density, new materials need to be developed to manage thermal effects of next-generation integrated circuits. Multiwall carbon nanotubes (MWNT) have been shown to significantly enhance thermal conduction in the axial direction and thus can be considered to be a candidate for future thermal interface materials by facilitating efficient thermal transport. This work focuses on fabrication and characterization of a robust MWNT-copper composite material as an element in IC package designs. We show that using vertically aligned MWNT arrays reduces interfacial thermal resistance by increasing conduction surface area, and furthermore, the embedded copper acts as a lateral heat spreader to efficiently disperse heat, a necessary function for packaging materials. In addition, we demonstrate reusability of the material, and the absence of residue on the contacting material, both novel features of the MWNT-copper composite that are not found in most state-of-the-art thermal interface materials. Electrochemical methods such as metal deposition and etch are discussed for the creation of the MWNT-Cu composite, detailing issues and observations with using such methods. We show that precise engineering of the composite surface affects the ability of this material to act as an efficient thermal interface material. A thermal contact resistance measurement has been designed to obtain a value of thermal contact resistance for a variety of different thermal contact materials.
Document ID
20050081904
Acquisition Source
Ames Research Center
Document Type
Conference Paper
Authors
Ngo, Quoc
(NASA Ames Research Center Moffett Field, CA, United States)
Cruden, Brett A.
(NASA Ames Research Center Moffett Field, CA, United States)
Cassell, Alan M.
(NASA Ames Research Center Moffett Field, CA, United States)
Sims, Gerard
(NASA Ames Research Center Moffett Field, CA, United States)
Li, Jun
(NASA Ames Research Center Moffett Field, CA, United States)
Meyyappa, M.
(NASA Ames Research Center Moffett Field, CA, United States)
Yang, Cary Y.
(Santa Clara Univ. CA, United States)
Date Acquired
August 22, 2013
Publication Date
January 1, 2005
Subject Category
Composite Materials
Meeting Information
Meeting: 2005 TMS Annual Meeting
Location: San Francisco, CA
Country: United States
Start Date: February 13, 2005
End Date: February 17, 2005
Funding Number(s)
CONTRACT_GRANT: NAS2-03144
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.

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