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Blanch Resistant and Thermal Barrier NiAl Coating Systems for Advanced Copper AlloysA method of forming an environmental resistant thermal barrier coating on a copper alloy is disclosed. The steps include cleansing a surface of a copper alloy, depositing a bond coat on the cleansed surface of the copper alloy, depositing a NiAl top coat on the bond coat and consolidating the bond coat and the NiAl top coat to form the thermal barrier coating. The bond coat may be a nickel layer or a layer composed of at least one of copper and chromium-copper alloy and either the bond coat or the NiAl top coat or both may be deposited using a low pressure or vacuum plasma spray.
Document ID
20050168081
Acquisition Source
Headquarters
Document Type
Other - Patent
Authors
Sai V Raj
Date Acquired
August 23, 2013
Publication Date
January 4, 2005
Subject Category
Metals And Metallic Materials
Distribution Limits
Public
Copyright
Work of the US Gov. Public Use Permitted.
Patent
US-Patent-6,838,191
Patent Application
US-Patent-Appl-SN-441028
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