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SIP qualification and PRA approachesSystem in a package (SIP) development is a response to an increasing demand for integration of different functions into one unit to reduce size and cost and improve functionality. Qualification of the newly developed multifunctional electronics are becoming complex at the package level and even more at the second and system levels.
Document ID
20060030007
Acquisition Source
Jet Propulsion Laboratory
Document Type
Conference Paper
External Source(s)
Authors
Ghaffarian, R.
Goetz, M.
Date Acquired
August 23, 2013
Publication Date
September 22, 2002
Distribution Limits
Public
Copyright
Other
Keywords
probability risk assessment weibull lognormal ball grid array BGA FCBGA IPC9701
solder joint reliability systems-in-a-package SIP

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