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Reliability of BGA Packages for Highly Reliable Application and Chip Scale Package Board Level ReliabilityDiffenent aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included understanding assembly reliability behavior of conventional surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Document ID
20060035366
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
hdl:2014/22345
Authors
Ghaffarian, Reza
Date Acquired
August 23, 2013
Publication Date
September 1, 1997
Distribution Limits
Public
Copyright
Other
Keywords
BGA Package Chip Scale Reliability

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