NASA Logo

NTRS

NTRS - NASA Technical Reports Server

Collections About News Help Login
Back to Results
CSP/BGA Board level ReliabilityDifferent aspects of advanced surface mount package technology have been investigated for aerospace applications. Three key areas included the assembly reliability of conventional Surface Mount, Ball Grid Arrays (BGAs), and Chip Scale Packages.
Document ID
20060035827
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
hdl:2014/22990
Authors
Ghaffarian, R.
Date Acquired
August 23, 2013
Publication Date
March 1, 1998
Distribution Limits
Public
Copyright
Other
Keywords
package type board material surface finish solder volume environmental condition

Available Downloads

There are no available downloads for this record.

Related Records

There are no records associated with this record.
No Preview Available