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Continuous Process InvolvementThe Electronic Fabrication Section at the Jet Propulsion Laboratories (JPL) has been studying ways to improve Printed Wiring Assembly (PWA) processes. The PWA study described here contained typical surface mount devices including 20 mil fine pitch devices and various BGAs.
Document ID
20060035856
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
hdl:2014/23033
Authors
Mehta, A.
Date Acquired
August 23, 2013
Publication Date
March 1, 1998
Distribution Limits
Public
Copyright
Other
Keywords
surface mount component component lead forming lead tinning coplanarity check
solderability test rework/repair

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