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Taguchi Experimental Design for Cleaning PWAs with Ball Grid ArraysBall grid arrays (BGAs), and other area array packages, are becoming more prominent as a way to increase component pin count while avoiding the manufacturing difficulties inherent in processing quad flat packs (QFPs)...Cleaning printed wiring assemblies (PWAs) with BGA components mounted on the surface is problematic...Currently, a low flash point semi-aqueous material, in conjunction with a batch cleaning unit, is being used to clean PWAs. The approach taken at JPL was to investigate the use of (1) semi-aqueous materials having a high flash point and (2) aqueous cleaning involving a saponifier.
Document ID
20060036787
Acquisition Source
Jet Propulsion Laboratory
Document Type
Preprint (Draft being sent to journal)
External Source(s)
Authors
Bonner, J. K.
Mehta, A.
Walton, S.
Date Acquired
August 23, 2013
Publication Date
February 25, 1997
Distribution Limits
Public
Copyright
Other
Keywords
ball grid array area array package semi-aqueous cleaning flash point
rosin residue
aqueous/saponifier cleaning design of experiment DOE Taguchi DOE TDOE wuality
characteristics output characteristics ionic contamination testing ionic residue

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